5G and the Next Industrial Revolution

Peter Vetter, Nokia Bell Labs, Murray Hill, NJ, USA.

Abstract: We are currently at the verge of a new industrial revolution that will enable human to “create time” by automation of everything. While the capacity of future wireless systems will be significantly boosted thanks to highly spectral-efficient modulation schemes being proposed and much wider signal bandwidths available, the radio systems that feature sub-millisecond latency and can be as reliable as wireline connections will be increasingly important for the future of automation. In this talk, we will present how the new transformation will be driven by enterprise applications, and particularly discuss why low latency will be absolutely critical and how the vision of a new Future X architecture will drive innovations in wireless communications in 5G and beyond.

Speaker's Bio: Peter Vetter is Head of Access Research Lab in Nokia Bell Labs and he is Bell Labs Fellow. He is leading an eminent global team across ten Bell Labs locations with the mission to invent game changing innovations that define the future of mobile and fixed access. Under his leadership, he and his teams have realized several world-first system demonstrations in access and successfully transferred industry leading concepts into product. Peter received the degree of Physics Engineer from Gent University (Belgium) in 1986 and a PhD with Prof. H. Pauwels in 1991. After a post-doctoral fellowship with Prof. T. Uchida at Tohoku University (Japan), he joined the research center of Alcatel (now Nokia) in Antwerp in 1993. Since 2009, he works at Bell Labs in Murray Hill, New Jersey.


Towards Ultimate Integration of Everything for Future Wireless Systems

Ke Wu, Ècole Polytechnique Montreal, Quebec, Canada.

Abstract: Recent research and development of transceiver architectures, technologies and systems over MHz-through-THz frequency range have generated a significant momentum for future wireless applications. This leap forward is being propelled by the organic fusion of multiple functions and the scalable integration of multiple technologies. This presentation begins with the overview of fundamental wireless functionalities. Emerging advances in multifunction, multiscale, multimaterial and multiband wireless technologies will be reviewed. Technological roadmap is highlighted with reference to enabling and building technological elements, ranging from current and emerging compound materials to evolving and beyond CMOS, and from developing substrate integrated circuits to future electromagnetic techniques. The talk also provides a brief tour of the state-of-the-art wireless devices, antennas, circuits, systems and applications. Challenging issues and future directions of wireless technologies including 5G and beyond are discussed towards the ultimate integration of everything (UIE).

Speaker's Bio: Ke Wu is Professor of Electrical Engineering at Polytechnique Montreal (University of Montreal). He holds the NSERC-Huawei Industrial Research Chair in Future Wireless Technologies and he is the Director of the Poly-Grames Research Center. He was the Canada Research Chair (2002-2016) in RF and millimeter-wave engineering and the Founding Director (2008-2014) of the Center for Radiofrequency Electronics Research of Quebec. Dr. Wu is also leading a collaborative 5G and wireless research project at Ningbo University, on leave from his home institution. He has authored/co-authored over 1200 referred papers, and a number of books/book chapters and more than 50 patents. Dr. Wu was the general chair of the 2012 IEEE MTT-S International Microwave Symposium and was the 2016 President of the IEEE Microwave Theory and Techniques Society (MTT-S). He is a Fellow of the IEEE, a Fellow of the Canadian Academy of Engineering (CAE) and a Fellow of the Royal Society of Canada.


The Rapidly Evolving World of 5G Power Amplifiers

Peter Asbeck, University of California, San Diego, CA, USA.

Abstract: Power amplifier technology has been advancing at a furious pace to meet the challenges posed by 5G: higher carrier frequencies, wider signal bandwidths, higher peak-to-average power ratios and more complex signal constellations, all without sacrificing efficiency. There is vigorous competition between device technologies: SiGe HBT, CMOS, GaAs, GaN and InP. This talk reviews recent directions for progress, and problems remaining to be solved. In sub-6GHz PAs, 200MHz signal bandwidths and wide carrier frequency range (3.4-4.2GHz) are now available with good efficiency. Doherty and outphasing amplifiers have been demonstrated at 28GHz with more than 25% power-added efficiency at 6dB backoff. Amplification of 64QAM OFDM signals with 0.8 to 2GHz bandwidths without predistortion has been widely reported; analog predistortion is also receiving attention along with DPD. Integration with LNAs and switches is also straightforward in most cases. Despite lingering uncertainties about system and PA specifications, system designers can anticipate that most of their expectations will be met. Increased attention is being given to ruggedness, reliability, ease of calibration, and, of course, cost. Potentially multiband or even full-duplex operation will emerge in the future.

Speaker's Bio: Peter Asbeck is a Professor in the Department of Electrical and Computer Engineering at the University of California, San Diego, and member of UCSD’s Center for Wireless Communications. His research centers on high performance transistor technologies and their application to wireless power amplifiers. He attended MIT, where he received the B.S. and Ph.D. degrees in 1969 and in 1975, respectively. From 1978 to 1991, he was with Rockwell International Science Center, where he was involved in the development of high speed devices and circuits using III-V compounds and heterojunctions. Dr. Asbeck is a member of the U.S. National Academy of Engineering, and has been a Distinguished Lecturer of the IEEE Electron Device Society, and of the Microwave Theory and Techniques Society. He received the 2003 IEEE David Sarnoff Award for his work on heterojunction bipolar transistors, and the 2012 IEEE MTT Distinguished Educator Award.


The Need for Massive MIMO in 5G Deployment

Mike Ziehl, MACOM, Lowell, MA, USA.

Abstract: 5G promises to deliver dramatic improvements in spectral efficiency, but achieving this promise will require major innovation in the way wireless infrastructure basestations are architectured. The current generation of wireless basesations rely on multiple input, multiple output (MIMO) antennae configurations of two to eight antennas to multiply the capacity of antenna links by concentrating signal strength into smaller areas of space, boosting overall efficiency and throughput. To provide the requisite data rates for 5G, basestations will now require anywhere from 64 to hundreds of antennas to be arrayed in a “massive MIMO” (M-MIMO) configuration, which can deliver full channel capacity by reusing the same frequency and time resources, provided they have compact front-end solutions delivering optimal RF and thermal performance. These M-MIMO systems have a noticeable parallel to the new generation of Multifunction Phased Array Radar (MPAR) systems, which share the 2.6 to 3.5 GHz frequency and antenna architecture and leverage Scalable Planar Array Tiles (SPARTM) to integrate the antenna and RF front-end modules into a single multilayer RF board using accelerated processes to minimize yield risks. SPAR tile technology is a newly developed cost-conscious approach to phased array radar system development, leveraging highly-integrated antenna sub-systems and volume scale commercial packaging and manufacturing techniques to help unlock the full promise of 5G.

Speaker's Bio: Mike Ziehl is the Vice President of Marketing for the RF and Microwave business unit at MACOM and has been with MACOM for close to 3 years. Mike has over 20 years in the global semiconductor industry with various roles in building global communications, RF and GaN product and technology portfolios. Prior to MACOM, he served as the business creation team manager for RF power Multi-Market products at NXP Semiconductors, Netherlands. While at NXP his team was responsible for NXP’s initial GaN product portfolio, garnering several design wins. Prior to NXP, Mike served in a variety of marketing and management roles in public companies such as Hittite Microwave, GlobespanVirata, Analog Devices, and Rockwell Semiconductor Systems. He also served as VP of Marketing and Business Development at Kenet, a start-up high performance, low-power analog-to-digital converter company, which was acquired by Intersil in late 2008. Mr. Ziehl holds a BSEE degree from Fairfield University and an MBA from Rensselaer Polytechnic Institute.